Breakthrough in Low-Temperature Copper Bonding Technology Enables Next-Generation Electronics Manufacturing

Our team has successfully developed a nanocrystalline (NC) copper material for direct copper-to-copper (Cu-Cu) bonding that works at lower temperatures with excellent bonding quality, which is an attractive solution for advanced electronic packaging. This work was recently published in Nature Communications, titled “Nanocrystalline Copper for Direct Copper-to-copper Bonding with Improved Cross-interface Formation at Low Thermal Budget”.

https://www.cityu.edu.hk/research/stories/2025/01/16/breakthrough-low-temperature-copper-bonding-technology-enables-next-generation-electronics-manufacturing