Our team is committed to developing new electroplating technologies to fabricate nanostructured materials for various applications, such as catalytic CO2 conversion, triboelectric, and 3D integrated circuit (3DIC). Recently, we are more focused on developing additives in electroplating baths to control copper nanostructures to engineer electrical, thermal, and mechanical properties for 3DIC packaging applications. As the increased use of the Internet is dramatically increasing the carbon footprint, 3D IC stacking technology can also be a key enabler to improve the energy efficiency.
Electrodeposition of (111)-Oriented and Nanotwin-Doped Nanocrystalline Cu with Ultrahigh Strength for 3D IC Application, Nanotechnology, 32, 225702, 2021.
Surface silanization of polyimide for autocatalytic metallization, The Journal of The Minerals, Metals & Materials Society (JOM), 72, 3529-3537, 2020.
Efficient Electroreduction of CO2 to CO by Ag Decorated S-doped g-C3N4/CNT Nanocomposites at Industrial-scale Current Density, Materials Today Physics, 12, 100176, 2020.
Study of Grain Size Effects of Cu Metallization on Interfacial Microstructures of Solder Joints, Microelectronics Reliability, 99, 44-51, 2019.