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Nanofabrication

234

C. Chen, S. J. Cherng, C. He, C. C. Chung, S. Wang, Y. T. Huang, S. P. Feng, Nanotwinning-assisted Structurally Stable Copper for Fine-pitch Redistribution Layer in 2.5D/3D IC Packaging, Journal of Materials Research and Technology, 27, 4883-4890, 2023.

2023

234

Y. Wang, Y. T. Huang , Y. X. Liu, S. P. Feng , M. X. Huang, Thermal Instability of Nanocrystalline Cu Enables Cu-Cu Direct Bonding in Interconnects at Low Temperature, Scripta Materialia, 220, 114900, 2022.

2022

234

Z. Xu, L. Wang, X. Huan, H. K. Lee, J. H. Yang, Z. Zhou, M. Chen, S. Hu, Y. Liu, S. P. Feng, T. Zhang, F. Xu, Z. Chu, J. T. Kim, On-Demand, Direct Printing of Nanodiamonds at the Quantum Level, Advanced Science, 9, 2103598, 2022.

2022

234

J. Yang, M. Chen, H. Lee, Z. Xu, Z. Zhou, S. P. Feng, J. T. Kim, Three-Dimensional Printing of Self-Assembled Dipeptides, ACS Applied Materials & Interfaces, 13, 20573-20580, 2021.

2021

234

Z. Zheng, Y. T. Huang, Z. Wang, M. Zhang, W. T. Wang, C. C. Chung, S. J. Cherng, Y. H. Tsai, P. C. Li, Z. Lu, C. M. Chen, S. P. Feng, Electrodeposition of (111)-Oriented and Nanotwin-Doped Nanocrystalline Cu with Ultrahigh Strength for 3D IC Application, Nanotechnology, 32, 225702, 2021.

2021

234

P. C. Chiang, Y. A. Shen, S. P. Feng, C. M. Chen, Electrodeposition of Twinned Cu with Strong Texture Effect on Voiding Propensity in Electroplated Cu Solder Joints, Journal of The Electrochemical Society, 167, 162516, 2021. 

2021

234

P. Swetha, J. Chen, A. S. Kumar, S. P. Feng, High index facets-Ag nanoflower enabled efficient electrochemical detection of lead in blood serum and cosmeticsJournal of Electroanalytical Chemistry, 878, 114657, 2020.

2020

234

J. N. Liu, M. C. Sil, R. Cheng, S. P. Feng, C. M. Chen, Surface silanization of polyimide for autocatalytic metallization, The Journal of The Minerals, Metals & Materials Society (JOM), 72, 3529-3537, 2020. 

2020

234

B. Peng, X. Ji, M. Chu, J. Liu, Y. Li, M. Chen, Z. Zhou, C. Zhang, Q. Miao, H. Dong, B. Huang, W. Hu, S. P. Feng, W. D. Li, K. L. Chan, A Transfer Method for Organic Semiconductor Towards High-mobility, Bias-stable, and Flexible Field Effect TransistorsAdvanced Materials Technologies, 5, 2000169, 2020.

2020

234

J. Chen, Z. Wang, J. Mao, C. Liu, Z. Lu, Y. Chen, S.P. Feng, Bimetallic Ag-Cu Nanosheets Assembled Flower-like Structure for Oxygen Reduction Reaction, Journal of Alloys and Compounds, 856, 157379, 2020. 

2020

234

A. Khan, C. Liang, Y. T. Huang, C. Zhang, J. Cai, S. P. Feng, W. D. Li, Template‐Electrodeposited and Imprint-Transferred Microscale Metal-Mesh Transparent Electrodes for Flexible and Stretchable Electronics, Advanced Engineering Materials, 21, 1900723, 2019.

2019

234

Z. Zhou, Q. Wu, S. Wang, Y. T. Huang, H. Guo, S.P. Feng, P.K.L. Chan, Field-Effect Transistors Based on Two-Dimensional Organic Semiconductors Developed by a Hybrid Deposition Method, Advanced Science, 6, 1900775, 2019.

2019

234

C. Liu, Q. Song, J. Chen, X. Li, J. Cai, Z. Lu, W. D. Li, N. X. Fang, S. P. Feng, Electromagnetic and Chemical Enhancements of Surface-Enhanced Raman Scattering Spectra from Cu2O Hexagonal Nanoplates, Advanced Materials Interfaces, 6, 1900534, 2019.

2019

234

S. T. Tsai, P. C. Chiang, C. Liu, S. P. Feng, C. M. Chen, Suppression of Void Formation at Sn/Cu Joint Due to Twin Formation in Cu Electrodeposit, The Journal of The Minerals, Metals & Materials Society (JOM), 71, 3012-3022, 2019. 

2019

234

Z. Zheng, P. C. Chiang, Y. T. Huang, W. T. Wang, P. C. Li, Y. H. Tsai, C. M. Chen, S. P. Feng, Study of Grain Size Effects of Cu Metallization on Interfacial Microstructures of Solder Joints, Microelectronics Reliability, 99, 44-51, 2019.

2019

234

J. Cai, M. Zhang, Z. Sun, C. Zhang, C. Liang, A. Khan, X. Ning, H. Ge, S. P. Feng, W. D. Li, Highly-facile Template-based Selective Electroless Metallization of Micro- and Nanopatterns for Plastic Electronics and PlasmonicsJournal of Materials Chemistry C, 7, 4363-4373, 2019.

2019

234

Z. Yang, X. Huang, X. Ma, Z. Zhou, H. Guo, Z. Yao, S. P. Feng, C. Y. Tang, Fabrication of a Novel and Green Thin-film Composite Membrane Containing Nanovoids for Water PurificationJournal of Membrane Science, 570, 314-321, 2019.

2019

234

J. Chen, C. Liu, Y. T. Huang, H. Lee, S. P. Feng, Study of the Growth Mechanisms of Nanoporous Ag Flowers for Non-Enzymatic Glucose DetectionNanotechnology, 29, 505501, 2018 (Featured as front cover).

2018

234

P. Swetha, S. P. Feng, High-index Facet Defined Shaped-controlled Electrochemical Synthesis of NanocrystalsElectrochemistry Communications, 94, 64-69, 2018.

2018

234

K. W. Kwan, S. J. Li, N. Y. Hau, W. D. Li, S. P. Feng, A. H. W. Ngan, Light-stimulated Actuators Based on Nickel Hydroxide-oxyhydroxide, Science Robotics, 3, eaat4051, 2018.

2018

234

Y. C. Tseng, H. Lee, N. Y. Hau, S. P. Feng, C. M. Chen,  Electrodeposition of Ni on Bi2Te3 and Interfacial Reaction Between Sn and Ni-coated Bi2Te3Journal of Electronic Materials, 47, 27-34, 2018.

2018

234

Y. H. Chang, C. Liu, S. Rouvimov, T. Luo, S. P. Feng, Electrochemical Synthesis to Convert a Ag Film to Ag Nanoflowers with High Electrocatalytic Activity, Chemical Communications, 53, 6752-6755, 2017.

2017

234

C. F. Lin, N. Y. Hau, Y. T. Huang, Y. H. Chang, S. P. Feng, C. M. Chen, Synergetic Effect of Bi2Te3 Alloys and Electrodeposition of Ni for Interfacial Reactions at Solder/Ni/Bi2Te3 Joints, Journal of Alloys and Compounds, 708, 220-230, 2017.

2017

234

N. Y. Hau, P Yang, P. H. Lee, S. P. Feng, Aminosilane-assisted Electrodeposition of Gold Nanodendrites and Their Catalytic PropertiesScientific Reports, 7, 39839, 2017.

2017

234

K. C. Lai, P. Y. Wu, C. M. Chen, T. C. Wei, C. H. Wu, S. P. Feng, Interfacial Characterizations of a Nickel-phosphorus Layer Electrolessly Deposited on a Silane Compound-modified Silicon Wafer under Thermal Annealing, Journal of Electronic Materials, 45, 4813-4822, 2016.

2016

234

C. Liu, H. Lee, Y. H. Chang, S. P. Feng, The Study of Electrical Conductivity and Diffusion Behavior of Water-based and Ferro/ferricyanide-electrolyte-based Alumina Nanofluids, Journal of Colloid and Interface Science, 469, 17-24, 2016.

2016

234

Y. H. Chang, S. P. Feng, Stepwise Anodic Electrodeposition of Nanoporous NiOOH/Ni(OH)2 with Controllable Wettability and its Applications, HKIE Transactions, 22, 202-211, 2015. (HKIE outstanding paper award)

2015

234

Y. Cai, H. E. Wang, M. J. Xu, Y. Yu, J. Jin, R. L. Zhang, Y. Li, S. P. Feng, B. L. Su, Hierarchically Structured Porous TiO2 Microspheres Constructed by Interconnected Coarse Nanorods as High-performance Lithium-ion Battery Anode, Chemical Engineering Journal, 281, 844-851, 2015.

2015

234

H. T. Yu, T. C. Wei, P. Zhai, S. P. Feng, M. Ikegami, T. Miyasaka, A Room-temperature Process for Fabricating a Nano-Pt Counter Electrode on a Plastic Substrate for Efficient Dye-sensitized Cells, Journal of Power Sources, 283, 351-357, 2015.

2015

234

2015

234

Y. H. Chang, N. Y. Hau, C. Liu, Y. T. Huang, C. C. Li, K. Shih, S. P. Feng, A Short-range Ordered-disordered Transition of NiOOH/Ni(OH)2 Pair Induces Switchable Wettability, Nanoscale, 6, 15309-15315, 2014.

2014

234

F. Xie, S. J. Cherng, S. Lu, Y. H. Chang, W. E. I. Sha, S. P. Feng, C. M. Chen, W. C. H. Choy, Functions of Self-assembled Ultrafine TiO2 Nanocrystals for High Efficient Dye-sensitized Solar Cells, ACS Applied Materials & Interfaces, 6, 5367-5373, 2014.

2014

234

Z. Wang, C. Fan, X. Ren, Y. H. Chang, H. Li, S. P. Feng, S. Shi, P. K. L. Chan, Low Cost Universal High-k Dielectric for Solution Processing and Thermal Evaporation Organic Transistors, Advanced Materials Interfaces, 1, 1300119-1300125, 2014.

2014

234

N. Y. Hau, Y. H. Chang, Y. T. Huang, T. C. Wei, S. P. Feng, Direct Electroplated Metallization on Indium Tin Oxide Plastic Substrate, Langmuir, 30, 132-139, 2014.

2014

234

Y. H. Chang, Y. T. Huang, M. K. Lo, C. F. Lin, C. M. Chen, S. P. Feng, Electrochemical Fabrication of Transparent Nickel Hydroxide Nanostructures with Tunable Superhydrophobicity/Superhyrophilicity for 2D Microchannels Application, Journal of Materials Chemistry A, 2, 1985-1990, 2014.

2014

234

H. K. Cheng, S. P. Feng, Y. J. Lai, K. C. Liu, Y. L. Wang, T. F. Liu, C. M. Chen, Effect of Polyimide Baking on Bump Resistance in Flip-chip Solder Joints, Microelectronics Reliability, 54, 629-632, 2014.

2014

234

H. Su, J. Zhang, W. Ma, K. Wei, L. Liu, H. Fu, S. P. Feng, A. K. Soh, In-situ Fabrication of Highly Dense Nanoeutectic Al2O3/YAG Composite Ceramics by a Modified Laser Surface ProcessingJournal of the European Ceramic Society, 34, 739-744, 2014.

2014

234

H. P. Feng, T. Paudel, B. Yu, S. Chen, Z. F. Ren, G. Chen, Nanoparticle-enabled Selective ElectrodepositionAdvanced Materials, 23, 2454-2459, 2011. 

2011

234

H. P. Feng, B. Yu, S. Chen, K. Collins, C. He, Z. F. Ren, G. Chen, Studies on Surface Preparation and Smoothness of Nanostructured Bi2Te3-based Alloys by Electrochemical and Mechanical Methods, Electrochimica Acta, 56, 3079-3084, 2011.

2011

234

M. Y. Cheng, K. W. Chen, T. F. Liu, Y. L. Wang, H. P. Feng, Effects of Direct Current and Pulse-reverse Copper Plating Waveforms on the Incubation Behavior of Self-annealing, Thin Solid Films, 518, 7468-7474, 2010.

2010

234

H. P. Feng, J. Y. Lin, Y. Y. Wang, C. C. Wan, Effect of Light Illumination for Copper Oxidation After Chemical Mechanical PolishingJournal of the Electrochemical Society, 155, H620-624, 2008.

2008

234

H. P. Feng, J. Y. Lin, M. Y. Cheng, Y. Y. Wang, C. C. Wan, Behavior of Copper Removal by CMP and its Correlation to Deposit Structure and Impurity ContentJournal of the Electrochemical Society, 155, H21-25, 2008.

2008

234

J. Y. Lin, C. C. Wan, Y. Y. Wang, H. P. Feng, Void Defect Reduction after Chemical Mechanical Planarization of Trenches Filled by Direct/Pulse PlatingJournal of the Electrochemical Society, 154, D139-144, 2007.

2007

234

J. Y. Lin, Y. Y. Wang, C. C. Wan, H. P. Feng, M. Y. Cheng, Impurity Induced Localized Corrosion Between Copper and Tantalum Nitride during Chemical Mechanical PlanarizationElectrochemical and Solid-State Letters, 10, H23-26, 2007.

2007

234

H. P. Feng, M.Y. Cheng, Y. L. Wang, S. C. Chang, Y. Y. Wang, C.C. Wan, Mechanism for Cu Void Defect on Various Electroplated Film Conditions, Thin Solid Films, 498, 56-59, 2006.

2006

234

C. W. Liu, Y. L. Wang, M. S. Tsai, H. P. Feng, S. C. Chang, G. J. Hwang, Effect of Plating Current Density and Annealing on Impurities in Electroplated Cu filmJournal of Vacuum Science & Technology A, 23, 658-662, 2005.

2005

234

H. P. Feng, Y. Wu, Y. Y. Wang, C. C. Wan, Electroless Cu Deposition Process on TiN for ULSI Interconnect Fabrication via Pd/Sn Colloid ActivationJournal of Electronic Materials, 32, 9-17, 2003. 

2003

234

Y. Wu, W. C. Chen, H. P. Feng, C. C. Wan, Y. Y. Wang, Displacement Reaction between Metal Ions and Nitride Barrier Layer/silicon SubstrateJournal of the Electrochemical Society, 149, G309-317, 2002.

2002

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