CityUHK Pioneers Breakthrough in 3DIC Semiconductor Packaging Materials Strengthening Hong Kong’s Role in Next-Generation Semiconductor Manufacturing Technologies
- Jul 11
- 1 min read
Our research team, led by Professor Tony Feng Shien-Ping, from the Department of Systems Engineering at CityUHK, has been awarded funding under the “RAISe+ Scheme” to address the complex metallisation challenges in the packaging of 3D integrated circuit (3DIC) semiconductor chips. The awarded project is titled “Chemical Additive-Enabled Advancements in Electroplated Copper for Advanced Electronic Packaging and 3DIC Applications”.
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